Products
Your current position：Home > Products
Hot melt adhesive
Polyamide resin hot melt adhesive is soluble in organic solvent. It is hot melting viscosity is relevant with heating temperature. It has advantages of low viscosity, fine liquidity, fine flexibility and high bonding strength.
Properties and features
Fine low temperature solubility and melting property
High heat stability
Strong flexibility
Quality index
| Product model | Technical index | ||||
| Color and lustre(Fe-Co) | Viscosity (Mpa.s/25℃) |
Acidity (mgKOH/g) |
Amine value(mgKOH/g) | Softening point (ring and ball method)℃ |
|
| CXD-01 | ＜=7# | 150～250 | ＜=6 | ＜=5 | 110±5 |
| CXD-02 | ＜=7# | 250～350 | ＜=6 | ＜=5 | 108±5 |
Main uses
Hot melt adhesive for epoxy moulding compound of electric products
Hot melt adhesive of shoe material, dress and leather
Hot melting binding agent
Packaging and storage: two-in-one paper plastic bag. 25kg/bag
